Bottom-up approach for carbon nanotube interconnects

By Jun Li, Q. Ye, A. Cassell, H. Ng, R. Stevens, Jie Han, M. Meyyappan. 2003

489 citations recorded by the source corpus.

We report a bottom-up approach to integrate multiwalled carbon nanotubes (MWNTs) into multilevel interconnects in silicon integrated-circuit manufacturing. MWNTs are grown vertically from patterned catalyst spots using plasma-enhanced chemical vapor deposition. We demonstrate the capability to grow aligned structures ranging from a single tube to forest-like arrays at desired locations. SiO2 is deposited to encapsulate each nanotube and the substrate, followed by a mechanical polishing process for planarization. MWNTs retain their integrity and demonstrate electrical properties consistent with their original structure.

Subfields: Biomedical Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/5fad8ea7ee10b8566f88aefb01be39d07549381e

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In Biomedical Engineering

  1. Chuan Xu
  2. Hong Li
  3. Kaustav Banerjee
  4. Navin Srivastava
  5. Neophytos Neophytou
  6. Dmitri E. Nikonov
  7. Mark S. Lundstrom
  8. K. Rumpf

In Materials Chemistry

  1. Hong Li
  2. Kaustav Banerjee
  3. Chuan Xu
  4. Navin Srivastava
  5. Dmitri E. Nikonov
  6. Franz Kreupl
  7. Mark S. Lundstrom
  8. Gianluca Fiori

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