Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits

By Ramesh Abhari, George V. Eleftheriades. 2003

353 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/307e61cb9db370ca5e74e60c7082b179e097aed5

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In Aerospace Engineering

In Electrical and Electronic Engineering

In Electronic, Optical and Magnetic Materials

Citations in the corpus

Mutual Coupling Reduction in Patch Antenna Arrays by Using a Planar EBG Structure and a Multilayer Dielectric Substrate (2008, background): “Moreover, they are completely planar, which is an advantage from the point of view of manufacturing when compared to others that include vias [17], [6], [18], [7].”
A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits (2005, positive): “Because the dispersion property of the FR4 substrate is not considered in the modeling, slight difference between them is seen at higher frequencies above 4 GHz.”
Artificial magnetic conductor surfaces and their application to low-profile high-gain planar antennas (2005, background): “OVER the last few years the electromagnetic band gap (EBG) properties of passive metallodielectric arrays have been studied [1]–[4].”
Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications (2006, background): “pers have discussed the use of high-impedance surfaces (HISs) and high-dielectric thin films in EBG structures [2]–[7].”
Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures (2004, background): “…source between the power planes and it represents either a large time-varying switching current driver (large ) or a fast time-varying switching circuit (small ) or even a combination of both. is the impedance of the signal generator used in simulations and experiments, usually equal to 50 ohms.”
Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits (2005, methodology): “Recently, a new idea for eliminating the GBN is proposed by using a photonic bandgap (PBG) [5] or electromagnetic bandgap (EBG) structure on the ground plane to form a high-impedance surface (HIS) [ 1 ], [2].”
Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation (2010, background): “The typical isolation approaches include etched slots on power or ground planes [13], [29]–[34], a π filter with beads [35], or electromagnetic bandgap (EBG) structures [36]–[57].”