Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications
By Jongbae Park, A. Lu, K. M. Chua, L. L. Wai, Junho Lee, Joungho Kim. IEEE Microwave and Wireless Components Letters, 2006
67 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/dcb4f26bfb99b6c55776eef6d12e3bd3ac427c56
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In Electrical and Electronic Engineering
Citations in the corpus
- UC-EBG on LTCC for 60-GHz Frequency Band Antenna Applications (2009, background): “isolation has been demonstrated in [14] for 5–20 GHz.”
- Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation (2010, methodology): “The other is miniaturization techniques due to the trend of system in package [45], [49], [50].”
- The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future (2009, unknown): “Moreover, SIP offers the possibility of integrating an on-package decoupling capacitor with high values and high-quality factors [38] or specific filters such as EM band gaps [50].”