Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits

By Tzong-Lin Wu, Yen-Hui Lin, Ting-Kuang Wang, Chien-Chung Wang, Sin-Ting Chen. 2005

165 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/fd0848de1e0f658d1385f9d8dc77e01e96ffdd9f

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In Aerospace Engineering

1. Ting-Kuang Wang
2. Tzong-Lin Wu

In Electrical and Electronic Engineering

1. Ting-Kuang Wang
2. Tzong-Lin Wu

In Electronic, Optical and Magnetic Materials

1. Ting-Kuang Wang
2. Tzong-Lin Wu

Citations in the corpus

• Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation (2010, background): “layer and the vias for the coplanar EBG structure, but the power plane is periodically etched by slots and will degrade the SI for the signal traces referred to such patterned planes [44].”