Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

By Tzong-Lin Wu, Hao-Hsiang Chuang, Ting-Kuang Wang. IEEE transactions on electromagnetic compatibility (Print), 2010

206 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/3a16404e026c8a38207c8375cdba4377805e3828

How researchers see this paper

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In Electrical and Electronic Engineering

  1. Yuan’an Liu
  2. Yongle Wu
  3. Ahmed A. Kishk

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