Reliability and current carrying capacity of carbon nanotubes
By Bingqing Wei, R. Vajtai, Pulickel M. Ajayan. 2001
1,224 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Materials Chemistry
View Paper: https://www.semanticscholar.org/paper/06c0653d3cfb180d34851d555bc38808bd642335
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Biomedical Engineering
- Hong Li
- Kaustav Banerjee
- Jonathan N. Coleman
- Chuan Xu
- U. Khan
- Chuck Zhang
- Yurii K. Gun'ko
- Navin Srivastava
In Materials Chemistry
- Hong Li
- Kaustav Banerjee
- Chuan Xu
- Jonathan N. Coleman
- Navin Srivastava
- U. Khan
- Wen-Yan Yin
- Chuck Zhang
Citations in the corpus
- Small but strong: A review of the mechanical properties of carbon nanotube–polymer composites (2006, background): “The absence of scattering means that Joule heating is minimised so that nanotubes can carry very large current densities of up to 100 MA/cm [19].”
- Carbon nanotube (CNT) incorporated cementitious composites for functional construction materials: The state of the art (2019, background): “Another factor attributable for its low electrical resistivity is its current density, which is highest of any known material (109 A/cm2) [58,59].”
- Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (2009, background): “Graphene and CNTs also have very high current carrying capability (at least two orders of magnitude higher than that of Cu) [4], [32], [33].”
- Computational and experimental study of interfacial bonding of single-walled nanotube reinforced composites (2004, background): “Theoretical modeling [2–6] and experimental measurements [7–10] have showed that carbon nanotubes possess high tensile modulus and strength and can sustain large elastic strain.”
- Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects (2008, background): “More importantly, an isolated CNT can carry current densities in excess of 10 A/cm without any signs of damage even at an elevated temperature of 250 ◦C [5], thereby eliminating electromigration reliability concerns that plague nanoscale Cu interconnects [6]–[8].”
- On the Applicability of Single-Walled Carbon Nanotubes as VLSI Interconnects (2009, background): “CNTs have shown current-carrying capacity in excess of 1010 A/cm2 without any signs of damage even at an elevated temperature of 250 ◦C [3], [23], thereby eliminating the EM reliability concerns that plague nanoscale Cu interconnects.”
- Performance analysis of carbon nanotube interconnects for VLSI applications (2005, background): “The steep rise in parasitic resistance of copper interconnects poses serious challenges for interconnect delay [1] (especially at the global level where wires traverse long distances) and for interconnect reliability [3], hence it has a significant impact on the performance and reliability of…”
- Carbon nanotube–polymer composites: Chemistry, processing, mechanical and electrical properties (2010, background): “The latter can transport electrons over long lengths without significant interruption which makes them more conductive than copper [4,5].”