Seongmoo Heo
Electrical and Electronic Engineering · 2003–2009
A researcher in the Science corpus: 2 papers; trusts 3 researchers and is trusted by 12 researchers here, as inferred from the citation graph.
Subfields
- Electrical and Electronic Engineering — 5 citations into it; #3,567 of 16,539 by trust here, #10,714 by citations
Whom Seongmoo Heo trusts overall
Their strongest outbound trust, strongest first, inferred from their citations.
Who trusts Seongmoo Heo overall
- Jayanth Srinivasan
- James Mc Donald
- Mohamed A. Gomaa
- Weiping Liao
- Sarita V. Adve
- Margaret Martonosi
- Pradip Bose
- Michael D. Powell
- Lei He
- Jude A. Rivers
Papers from Seongmoo Heo's perspective
Ordered by how strongly the researchers Seongmoo Heo trusts endorse each paper. Same corpus, a different order for every researcher.
- Control-theoretic techniques and thermal-RC modeling for accurate and localized dynamic thermal management (Proceedings Eighth International Symposium on High Performance Computer Architecture)
- Automatically characterizing large scale program behavior (ASPLOS X)
- Managing multi-configuration hardware via dynamic working set analysis (Proceedings 29th Annual International Symposium on Computer Architecture)
- Phase tracking and prediction (30th Annual International Symposium on Computer Architecture, 2003. Proceedings.)
- Basic block distribution analysis to find periodic behavior and simulation points in applications (Proceedings 2001 International Conference on Parallel Architectures and Compilation Techniques)
- X-means: Extending K-means with Efficient Estimation of the Number of Clusters
- Dynamic thermal management for high-performance microprocessors (Proceedings HPCA Seventh International Symposium on High-Performance Computer Architecture)
- Learning the k in k-means (Neural Information Processing Systems)
- Experiments with Random Projection (Conference on Uncertainty in Artificial Intelligence)
- Some methods for classification and analysis of multivariate observations
Their papers
- Reducing power density through activity migration (2003) — 342 citations
- 8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology (2009) — 475 citations