Thermal effects in packaging high power light emitting diode arrays

By A. Christensen, S. Graham. 2009

323 citations recorded by the source corpus.

Subfields: Condensed Matter Physics, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/fdf2ecb97e91c4daebaa9fb4fa99454933bce37f

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Condensed Matter Physics

1. Xiaobing Luo
2. Sheng Liu
3. Kai Wang
4. R. Lopez
5. Run Hu
6. Wesley C. Randall

In Electrical and Electronic Engineering

1. Xiaobing Luo
2. R. Lopez
3. Wesley C. Randall

In Mechanical Engineering

1. Chaoyong Zhao
2. A. Tang
3. F. Pan
4. Xiaobing Luo
5. H. Pan
6. J. Peng
7. Sheng Liu
8. Zhengyuan Gao

Citations in the corpus

• Comparison of Supplemental Lighting from High-pressure Sodium Lamps and Light-emitting Diodes during Bedding Plant Seedling Production (2014, background): “The need for heat dissipation without significant shading poses challenges to developing LED arrays for greenhouse use, because the materials used to construct LED arrays are important factors for thermal dissipation (Bourget, 2008; Christensen and Graham, 2009).”
• Heat and fluid flow in high-power LED packaging and applications (2016, background): “Christensen and Graham [109] built a thermal resistance model for Luxeon packaging LED arrays.”
• Thermal and electrical conductivity of binary magnesium alloys (2014, background): “High thermal conductivity is beneficial to dissipate the excess heat and avoid the degradation by local heating [1, 2].”
• Light emitting diodes reliability review (2012, unknown): “tools, simulation, and prototype testing [29–36].”