Magneto-optical isolator with silicon waveguides fabricated by direct bonding
By Y. Shoji, T. Mizumoto, H. Yokoi, I. Hsieh, Richard M. Osgood. 2008
318 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/fb163e5c5b116a673d510f7b39db7ca0d96ae5a9
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In Atomic and Molecular Physics, and Optics
- C. Doerr
- John E. Bowers
- Di Liang
- Martijn J. R. Heck
- Alexandre Blais
- Gunther Roelkens
- Dong Hun Kim
- P. Jiang
In Electrical and Electronic Engineering
- John E. Bowers
- C. Doerr
- Di Liang
- Martijn J. R. Heck
- Gunther Roelkens
- G. Hilton
- Alexandre Blais
- Dong Hun Kim
Citations in the corpus
- On-chip optical isolation in monolithically integrated non-reciprocal optical resonators (2011, background): “Currently, the only experimentally demonstrated optical isolators on silicon still rely on wafer bonding of Ce-doped yttrium iron garnet films grown on garnet single crystals to a silicon-on-insulator (SOI) Mach–Zehnder structur”
- Hybrid Integrated Platforms for Silicon Photonics (2010, methodology): “addition to the UCSB-Intel research team and the European research team led by Ghent University, several groups worldwide have also made important contributions to this hybrid integration approach to active Si photonics [58–61].”
- Silicon photonic integration in telecommunications (2015, background): “In magneto-optic isolators, garnets are placed on the side or top of the waveguide [32, 33].”
- Widely Tunable On-Chip Microwave Circulator for Superconducting Quantum Circuits (2017, background): “Their drawbacks include their roughly 10 cubic cm volumes, and their reliance on large permanent magnets, which makes them difficult to miniaturize (despite many efforts [84, 85, 86, 87, 88, 89]) and integrate with superconducting circuits, and precludes the elimination of their insertion loss by re”
- Hybrid Silicon Photonic Integrated Circuit Technology (2013, methodology): “These PICs are enabled by the technology platform as discussed in Section II and make use of the components, or building blocks, as reviewed in Section III.”