On the film density using high power impulse magnetron sputtering

By M. Samuelsson, D. Lundin, J. Jensen, M. Raadu, J. Gudmundsson, Ulf Helmersson. 2010

389 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/e8304f238e5ec4bf2b59017cc32f350df8a132fb

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. D. Lundin
2. K. Sarakinos
3. A. Anders
4. J. Gudmundsson

In Materials Chemistry

1. D. Lundin
2. K. Sarakinos
3. A. Anders

In Mechanics of Materials

1. D. Lundin
2. K. Sarakinos
3. A. Anders
4. J. Gudmundsson

Citations in the corpus

• A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS) (2014, background): “In most but not all cases notably lower (several 10% lower) compared to the deposition rates of dc sputtering at the same power [309], primarily due to return effect of ionized sputtered material, but also affected by a host of other changes [310] including the energy dependence of the sputter yield”
• An introduction to thin film processing using high-power impulse magnetron sputtering (2012, methodology): “In a recent report by Samuelsson et al.,8 it was found that the rates are typically in the range of 30–80% compared to J. Mater.”