High power impulse magnetron sputtering : Current-voltage-time characteristics indicate the onset of sustained self-sputtering

By A. Anders, J. Andersson, A. Ehiasarian. 2007

338 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/d96e4e2486587dd688b6d4cc029be4b5c3966605

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. D. Lundin
2. K. Sarakinos
3. A. Anders
4. J. Gudmundsson

In Materials Chemistry

1. D. Lundin
2. K. Sarakinos
3. A. Anders

In Mechanics of Materials

1. D. Lundin
2. K. Sarakinos
3. A. Anders
4. J. Gudmundsson

Citations in the corpus

• An introduction to thin film processing using high-power impulse magnetron sputtering (2012, background): “For high yield materials such as Cu this has led to the onset of self-sputtering regimes characterized by a second increase of the discharge current beyond the value of the initial peak current, if the pulse is sustained for a long enough time in combination with high negative discharge voltages.(43”
• A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS) (2014, background): “Often the power is simply normalized by the entire target area, which gives nominal values of up to 10(7) W/m(2) [154, 257, 268].”