A new microtensile tester for the study of MEMS materials with the aid of atomic force microscopy
By I. Chasiotis, W. Knauss. 2002
249 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/d2b31019c06eefab525019ba4736afa56fa8aa2a
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In Atomic and Molecular Physics, and Optics
In Biomedical Engineering
In Electrical and Electronic Engineering
Citations in the corpus
- Mechanical measurements at the micron and nanometer scales (2003, unknown): “When measurements of the elastics constants were conducted (Chasiotis and Knauss, 2002), the compliance of the adhesive was measured using the microtensile testing experimental set-up and that value was used in the calculation of the material modulus.”
- Digital image correlation and fracture: an advanced technique for estimating stress intensity factors of 2D and 3D cracks (2009, background): “• Any (other than optical) digital image can be processed in the same way provided distortions, aberrations are not too large and uncontrolled [16, 17, 18].”
- Micro- and Nanoscale Deformation Measurement of Surface and Internal Planes via Digital Image Correlation (2007, methodology): “Gonzalez and Knauss [8] proved the feasibility of the technique and Abanto-Bueno and Lambros [9] extended the method to real-time measurements while imaging craze development in polyethylene.”
- Development of Patterns for Digital Image Correlation Measurements at Reduced Length Scales (2007, methodology): “Another complimentary measurement method employs an AFM and uses surface roughness as a characteristic random pattern [29–33] so that digital image correlation can be employed to obtain surface deformations at the nanoscale.”