Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

By Ya-Ting Wang, Y. W. Lin, C. Tu, C. Kao. 2009

189 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/f5118c45404f07c02fcb0ddf12eda7f4efd31e69