Physical modeling of spiral inductors on silicon

By C. Yue, S. Wong. 2000

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A New Analytical Calculation of the Mutual Inductance of the Coaxial Spiral Rectangular Coils (2014, background): “Although a lot of literature about the circular coils’ self- and mutual inductances calculations [5]–[12] and square coils’ self-inductance calculations [13]–[15] has been studied, the square coils’ mutual inductance calculations are limited [16], [17].”
Wireless Power Transfer in Loosely Coupled Links: Coil Misalignment Model (2011, background): “expression developed by Yue et al. in [41], [ 43 ].”
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring (2011, background): “parts [19], and a fringing term is included for the capacitance [20].”
Modeling of Mutual Coupling Between Planar Inductors in Wireless Power Applications (2014, background): “This is because, in the self-resonance dominated region, the inductor quality factor (Q) starts to degrade [34] and in turn”
High-Frequency Analysis of Carbon Nanotube Interconnects and Implications for On-Chip Inductor Design (2009, methodology): “In order to model on-chip inductors, the widely used π model [33] is modified to include the effect of substrate (by adding Leddy and Reddy components), as shown in Fig.”
Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects (2009, methodology): “π model [137] is modified to include the effect of the substrate, as shown in Fig.”