Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

By Jonghyun Cho, Eakhwan Song, Kihyun Yoon, J. Pak, Joohee Kim, Woojin Lee, Taigon Song, Kiyeong Kim, Junho Lee, Hyungdong Lee and 5 more. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2011

176 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

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