Thermal Interface Materials: Historical Perspective, Status, and Future Directions

By Ravi S. Prasher. Proceedings of the IEEE, 2006

843 citations recorded by the source corpus.

Subfields: Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/8dee90fe08392f4746095e04ee02ef20f235c5e2

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Materials Chemistry

1. Ronggui Yang
2. Xiaokun Gu
3. Xin Qian
4. Dongliang Zhao
5. S. Jajja
6. C. Wong
7. Jun Liu
8. Anthony J. Robinson

In Mechanical Engineering

1. Akhilesh V. Bapat
2. Satish G. Kandlikar
3. Ronggui Yang
4. Jun Liu
5. Anthony J. Robinson
6. G. Cross
7. Xiaobing Luo
8. Sheng Liu

Citations in the corpus

• Thermal interface materials for power electronics applications (2008, neutral): “The environment in automotive power electronics is harsher than it is in computer microelectronics [5].”
• Recently emerging trends in thermal conductivity of polymer nanocomposites (2016, background): “Hence, TIMs must be mechanically pliable so as to enhance conformity to the match surface asperities while forming a small bond-line-thickness (BLT) under reasonable assembly pressures (Prasher 2006).”
• Novel nanostructured thermal interface materials: a review (2018, background): “Also, the cost and complexity in processing is a concern [19].”
• Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal (2007, methodology): “A detailed survey of this field is provided by Prasher [6].”