Thermal interface materials for power electronics applications

By S. Narumanchi, M. Mihalic, Kenneth Kelly. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008

183 citations recorded by the source corpus.

Subfields: Civil and Structural Engineering, Materials Chemistry, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/010f11ed972ec5ae42a60133fd9359d059455045

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In Materials Chemistry

1. Johan Liu
2. J. Hansson

Citations in the corpus

• Novel nanostructured thermal interface materials: a review (2018, background): “It conforms well to the substrates and can form thin BLT, leading to thermal interface resistance approaching 10 Kmm(2) W for the highest performing thermal greases [6].”