Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal
By Satish G. Kandlikar, Akhilesh V. Bapat. 2007
283 citations recorded by the source corpus.
Subfields: Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/eb092e415daaffa3c3a6d77d90a14ac95e8762cf
How researchers see this paper
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In Mechanical Engineering
- Satish G. Kandlikar
- Gangtao Liang
- I. Mudawar
- Suresh V. Garimella
- Yoav Peles
- Ping Cheng
- Chinmay M. Patil
- Akhilesh V. Bapat
Citations in the corpus
- History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review (2012, background): “[20] Kandlikar, S.”
- Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits (2014, methodology): “Other cooling options using jet impingement and spray cooling have been evaluated by Kandlikar and Bapat [5].”