A SPICE Compact Model of Metal Oxide Resistive Switching Memory With Variations
By Ximeng Guan, Shimeng Yu, H. Philip Wong. IEEE Electron Device Letters, 2012
246 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/7609f648b74923cf46a63b950bb085e0e5355bf5
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In Electrical and Electronic Engineering
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Citations in the corpus
- A Physics-Based Compact Model of Metal-Oxide-Based RRAM DC and AC Operations (2013, background): “So far, much works have been done for modeling the switching behavior of metal–oxide-based RRAM [11]–[14] and some SPICE models based on the subcircuits have been presented to describe the features of a single device [15]–[17].”
- Resistive Random Access Memory (RRAM): an Overview of Materials, Switching Mechanism, Performance, Multilevel Cell (mlc) Storage, Modeling, and Applications (2020, methodology): “The variation in the gap size δg depends on kinetic energy of ions and filament temperature as [130]:”
- State Dynamics and Modeling of Tantalum Oxide Memristors (2013, methodology): “Subsequently, other compact resistance switching device models were developed and applied in several cases [16]–[23].”
- Hardware implementation of memristor-based artificial neural networks (2024, unknown): “Note that for other memristive models the state variable would be calculated following a different equation (for instance in the Stanford model 270 ).”
- Conduction Mechanism of Valence Change Resistive Switching Memory: A Survey (2015, background): “Compact modeling of resistive switching memory often consists of three inter-related modules, namely: (i) evolution of CF; (ii) conduction mechanism; and (iii) temperature dynamic evolution [15–18].”