Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion
By A. Ehiasarian, J. Wen, I. Petrov. 2007
297 citations recorded by the source corpus.
Subfields: Atomic and Molecular Physics, and Optics, Materials Chemistry, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/66eb6ac63c121028521a1c18a81a6037a95649c5
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In Atomic and Molecular Physics, and Optics
In Materials Chemistry
In Mechanics of Materials
Citations in the corpus
- An introduction to thin film processing using high-power impulse magnetron sputtering (2012, methodology): “of electronvolts, which can be used to engineer the film–substrate interface and enhance the film adhesion.(14) Typical example is a CrN/NbN film deposited on steel substrates etched using HiPIMS (pretreatment by Nb ions at a substrate bias voltage of 1000 V) exhibited a scratch test critical load (”
- Deposition rates of high power impulse magnetron sputtering: Physics and economics (2010, background): “The main motivation for using the extreme power density is the ionization of the sputtered material, which opens significant opportunities for substrate-coating interface engineering [6] and tailoring film growth and resulting properties [7].”