Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

By T. Bieler, Hairong Jiang, L. Lehman, T. Kirkpatrick, E. Cotts, Bala Nandagopal. IEEE transactions on components and packaging technologies, 2008

286 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/c48da4355c8155c3ee248d61cd54a22acc5572b0