Solder joint fatigue models: review and applicability to chip scale packages
By W. Lee, L. Nguyen, G. Selvaduray. 2000
514 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanics of Materials
View Paper: https://www.semanticscholar.org/paper/3b60d4055ea195f379326ae60f0e5c5aed41fba7
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Electrical and Electronic Engineering
- U. Choi
- Kyo-Beum Lee
- Frede Blaabjerg
- Ahmer Syed
- Xiongfei Wang
- Huai Wang
- Marco Liserre
- Friedrich Wilhelm Fuchs
In Mechanics of Materials
Citations in the corpus
- Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy (2001, methodology): “During the last decade, a number of life prediction models have been proposed to predict the thermal fatigue life of solder joint [1], mostly using finite element analysis approach.”
- Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints (2004, unknown): “Life Prediction Methodology A number of life prediction models have been proposed in the literature for SnPb solder [5, 12, 13] and more recently for SnAgCu solder interconnects [7, 8].”
- Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems (2015, background): “[23] has developed a fatigue life prediction methodology that considers the geometry of a solder joint.”