Hybrid-orientation technology (HOT): opportunities and challenges

By Min Yang, Victor Chan, K. K. Chan, Leathen Shi, David M. Fried, J. H. Stathis, A. Chou, Evgeni P. Gusev, John A. Ott, L. Burns and 2 more. IEEE Transactions on Electron Devices, 2006

159 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/2c58dc511abb9e3fcf251ec663cf4e4ace5b9ecf

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. C. Fenouillet-Béranger
2. C. Gallon
3. Frédéric Bœuf
4. S. Monfray
5. Fabrice Payet
6. Arnaud Pouydebasque
7. Thomas Skotnicki
8. Alexis Farcy

Citations in the corpus

• Negative bias temperature instability: What do we understand? (2007, unknown): “It is possible, however, to form planar (100) and (110) oriented surfaces on one wafer using SOI layer transfer technology [44].”
• Innovative Materials, Devices, and CMOS Technologies for Low-Power Mobile Multimedia (2008, background): “A practical implementation of these optimal configurations within a chip is extensively sought on SOI wafers [36] and on bulk wafers [37].”