Process

By M. A. Moote, B. A. Brown, Eric Kingsley, Steven X. Lee, Steve Marshall, D. E. Voth, Gregg B. Walker. 2001

1,200 citations recorded by the source corpus.

Subfields: Global and Planetary Change, Management, Monitoring, Policy and Law

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In Management, Monitoring, Policy and Law

Citations in the corpus

Learning Optimal Decision Trees with SAT (2018, background): “On the negative side, the construction of optimal decision trees is well-known to be NP-hard, for different notions of optimality [Hyafil and Rivest, 1976; Hancock et al., 1996].”
Excellent combination of strength and ductility in an Fe–9Al–28Mn–1.8C alloy (2010, background): “Therefore, the aging time required for attaining the optimal combination of strength and ductility was about 16 h at 550 C [8–13], and more than 500 h at 450 C [10,12].”
Additive Manufacturing of Ceramic‐Based Materials (2014, background): “6 © 2014 WILEY-VCH Ve between the nozzle and the previously deposited layers.([35])”
Quantum support vector machine for big feature and big data classification (2013, background): “Supervised learning involves a training set of already classiﬁed data, from which inferences are made to classify new data.”
A review of the latest developments in electrodes for unitised regenerative polymer electrolyte fuel cells (2006, background): “One of the most recent and exciting advances has been the announcement of carbon nanofibre technology [9] and [11].”
Correlations between nanoindentation hardness and macroscopic mechanical properties in DP980 steels (2014, neutral): “11 shows a plot of EDM HER versus steel thickness, and the observed positive linear correlation indicates that the resistance to failure in HER testing may increase with thicker sheets [46].”
Friction Stir Welding and Processing (2007, methodology): “Similarly, three-dimensional thermal model based on finite element analysis developed by Chao and Qi [70] and Khandkar and Khan [71] also showed reasonably good match between the simulated temperature profiles and experimental data for both butt and overlap FSW processes.”
Chemical mechanical planarization for microelectronics applications (2004, neutral): “Schematic of multi wafer per platen polisher [78].”
Recent advances in silica-alumina refractory: A review (2014, background): “[47] Dense mullite from attrition milled kyanite and -alumina 1600 Milling of kyanite and alumina for 12 h.”