Experimental study of thermoelastic damping in MEMS gyros
By Amy E. Duwel, J. Gorman, M. Weinstein, J. Borenstein, P. Ward. 2003
186 citations recorded by the source corpus.
We present new experimental data illustrating the importance of thermoelastic damping (TED) in MEMS resonant sensors. MEMS gyroscopes have been used to demonstrate that both the choice of materials and variations in device design can lead to significant differences in the measured quality (Q) factors of the device. These differences in the Q-factor can be explained by including the contribution of thermoelastic damping, which varies strongly between the different silicon etch-stop compositions used in this study. Known damping mechanisms, such as fluid damping, anchor damping, and electronics damping are minimized and held fixed in this experiment so that materials effects can be isolated.
Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/10b763495a1fa91c810f68ccdb82c35c1c0f0943
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In Atomic and Molecular Physics, and Optics
In Biomedical Engineering
In Electrical and Electronic Engineering
- David S. Bindel
- Sanjay Govindjee
- M. Imboden
- S. Vengallatore
- P. Mohanty
- S. Prabhakar
- Reza Abdolvand
- Brandon Harrington
Citations in the corpus
- Dissipation in nanoelectromechanical systems (2014, background): “[168] describe how, in the case of a MEMS gyroscope, thermoelastic dissipation can set the sensitivity limit.”
- Elastic PMLs for resonator anchor loss simulation (2005, background): “Thermoelastic damping is a frequentlycited source of losses at high frequencies [17, 21, 1, 23, 29].”
- Theory of Thermoelastic Damping in Micromechanical Resonators With Two-Dimensional Heat Conduction (2008, background): “Subsequent studies have confirmed that TED contributes significantly to damping in both single-crystal [6], [7] and polycrystalline [8], [9] silicon, poly-SiGe [10], and silicon nitride [11].”