Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

By Chuan Xu, Hong Li, Roberto Suaya, Kaustav Banerjee. IEEE Transactions on Electron Devices, 2010

273 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/3f73da47374d5cbb8a5ab6acd828514696529a57