Ionized physical vapor deposition (IPVD): A review of technology and applications

By Ulf Helmersson, M. Lattemann, Johan Böhlmark, A. Ehiasarian, J. Gudmundsson. 2006

1,011 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/0d3763d68acb009670fbfe828bc3811e65ed81ec

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In Electrical and Electronic Engineering

1. D. Lundin
2. K. Sarakinos
3. A. Anders
4. J. Gudmundsson

In Materials Chemistry

1. D. Lundin
2. K. Sarakinos
3. A. Anders

In Mechanics of Materials

1. D. Lundin
2. K. Sarakinos
3. A. Anders
4. J. Gudmundsson

Citations in the corpus

• An introduction to thin film processing using high-power impulse magnetron sputtering (2012, methodology): “This process is particularly efficient in HiPIMS discharges owing to the degree of ionization of the Ta vapor of up to 70%.(5) Ta forms both a low resistivity bodycentered cubic crystal structure (also known as the a phase) at elevated temperatures and a metastable high resistivity tetragonal phase ”