Thermo-mechanical reliability of 3-D ICs containing through silicon vias

By K. Lu, Xuefeng Zhang, Suk-kyu Ryu, J. Im, Rui Huang, P. Ho. Electronic Components and Technology Conference, 2009

224 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/cad11a07c504055843592482cd0592ec9d27324b