M.N. Islam

IEEE transactions on components and packaging technologies · with Darveaux · 2004

A researcher in the Science corpus: 1 paper; trusts 0 researchers and is trusted by 0 researchers here, as inferred from the citation graph.

Papers from M.N. Islam's perspective

Ordered by how strongly the researchers M.N. Islam trusts endorse each paper. Same corpus, a different order for every researcher.

1. Effect of simulation methodology on solder joint crack growth correlation (2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070))

Their papers

• Model for BGA and CSP reliability in automotive underhood applications (2004) — 137 citations