Model for BGA and CSP reliability in automotive underhood applications

By Pradeep Lall, M.N. Islam, N. Singh, J. Suhling, R. Darveaux. IEEE transactions on components and packaging technologies, 2004

137 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/b129d1a5d0f55638a14e7b0f3a5d3e6419c89d98