Modeling and simulations of thermoelastic damping in microplates

By Ali H. Nayfeh, Mohammad Ibrahim Younis. 2004

243 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/ffc7dff3e25719f11fad78bda2b38545e6567a32

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Atomic and Molecular Physics, and Optics

1. Romesh C. Batra
2. Maurizio Porfiri
3. Davide Spinello
4. Mohammad Ibrahim Younis
5. Eihab M. Abdel-Rahman
6. Ali H. Nayfeh
7. Kalpataru Das
8. Hassen M. Ouakad

In Electrical and Electronic Engineering

1. Romesh C. Batra
2. Maurizio Porfiri
3. Davide Spinello
4. Mohammad Ibrahim Younis
5. Eihab M. Abdel-Rahman
6. Ali H. Nayfeh
7. Kalpataru Das
8. Hassen M. Ouakad

In Mechanics of Materials

1. Romesh C. Batra
2. Maurizio Porfiri
3. Davide Spinello
4. Eihab M. Abdel-Rahman
5. Mohammad Ibrahim Younis
6. Ali H. Nayfeh
7. L. Qian
8. Erasmo Carrera

Citations in the corpus

• Reduced-Order Models for MEMS Applications (2005, methodology): “Nayfeh and Younis [63, 64] analyzed thermoelastic and squeeze-film damping in microplates.”
• Pull-in and snap-through instabilities in transient deformations of microelectromechanical systems (2009, background): “If the aspect ratio of the deformable electrode is large, approximation of the electrode as a plate is more appropriate [41–51].”
• Review of modeling electrostatically actuated microelectromechanical systems (2007, methodology): “In [91], thermoelastic damping is considered and numerical estimates of quality factors are established using perturbation techniques.”