Electromigration of eutectic SnPb solder interconnects for flip chip technology

By T. Lee, King-Ning Tu, S. Kuo, D. Frear. 2001

172 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/fef4b96901151c1a489249fd309e194c812f0f84

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “A few studies have been conducted to unravel the diffusivity and explore the effective charge number [18,21].”