Atomic Layer Deposition of Ruthenium Thin Films for Copper Glue Layer

By Oh-Kyum Kwon, Jaehoon Kim, Hyoung-Sang Park, Sang-Won Kang. 2004

160 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Renewable Energy, Sustainability and the Environment

View Paper: https://www.semanticscholar.org/paper/f1726f21dbf60b667895475e8b841525a7ef2dcf

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In Electrical and Electronic Engineering

1. Markku Leskelä
2. Mikko Ritala
3. Titta Aaltonen
4. Y. Chi

Citations in the corpus

• Atomic layer deposition of noble metals: Exploration of the low limit of the deposition temperature (2004, background): “Kwon et al.21 have reported that the growth rate of ruthenium films grown by ALD from Ru(EtCp)2 and oxygen depends on the oxygen partial pressure.”