Current-crowding-induced electromigration failure in flip chip solder joints

By E. Yeh, W. Choi, King-Ning Tu, P. Elenius, H. Balkan. 2002

352 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/f062ed4176c7d059492209331fce206da5b805b4

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, neutral): “Solder interconnects experiencing EM mostly exhibit such a characteristic of the variation of resistance [32,41,42].”