Evaluation of Single Phase Flow in Microchannels for High Heat Flux Chip Cooling—Thermohydraulic Performance Enhancement and Fabrication Technology

By Satish G. Kandlikar, W. Grande. 2004

209 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/e3ff5058dd26de9cc3c6ec17833c83fd14a01861

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Mechanical Engineering

1. Satish G. Kandlikar
2. Yoav Peles
3. Ali Kosar
4. Akhilesh V. Bapat
5. P. Lee
6. Chiang Juay Teo
7. Yi Sui
8. Y. T. Chew

Citations in the corpus

• Fluid flow and heat transfer in wavy microchannels (2010, background): “For intermediate heat fluxes, single-phase cooling offers an alternative that is simpler to implement and is thus preferable [5].”
• Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal (2007, methodology): “A comprehensive survey of single-phase cooling technology with microchannels was provided by Kandlikar and Grande [ 43 ].”
• Boiling heat transfer in a hydrofoil-based micro pin fin heat sink (2007, background): “As part of this endeavor, single-phase flows [1–10] and boiling flows [11– 28] have been topics of great interest.”
• High Flux Heat Removal with Microchannels—A Roadmap of Challenges and Opportunities (2005, background): “Kandlikar and Grande [ 4 ] showed the need for enhanced channels, and Steinke and Kandlikar [3] presented various channel configurations that would provide higher heat transfer coefficients.”