High Flux Heat Removal with Microchannels—A Roadmap of Challenges and Opportunities
By Satish G. Kandlikar. 2005
277 citations recorded by the source corpus.
Subfields: Electrical and Electronic Engineering, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/c154343a812beddd871ff7ddc0558093ed3ef01f
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Electrical and Electronic Engineering
In Mechanical Engineering
- Akhilesh V. Bapat
- Satish G. Kandlikar
- Gangtao Liang
- I. Mudawar
- Suresh V. Garimella
- Yoav Peles
- Ping Cheng
- Chinmay M. Patil
Citations in the corpus
- Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal (2007, methodology): “Address correspondence to Professor Satish G. Kandlikar, Mechanical Engineering Department, Rochester Institute of Technology, James E. Gleason Building, 76 Lomb Memorial Drive, Rochester, NY 14623-5603.”