The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging

By E. Wong, R. Rajoo, S. Koh, T. B. Lim. 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000

249 citations recorded by the source corpus.

View Paper: https://www.semanticscholar.org/paper/d752acc8e55457b604d66988326cb12d2d46f3f1

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. E. Wong
2. Prabhakar V. Varde
3. Michael G. Pecht
4. Diganta Das
5. Moon-Hwan Chang
6. H. Ardebili
7. Zhen Chen

Citations in the corpus

• Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging (2003, methodology): “In place of temperature and thermal expansion coefficients, moisture concentration and coefficient of swelling are respectively substituted [ 2 ].”
• Light emitting diodes reliability review (2012, background): “hygroscopic stress in the package, thus adding thermal stress at high reflow temperatures, thereby inducing delamination [127].”