Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

By H. Ardebili, E. Wong, Michael G. Pecht. 2003

145 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/c6c10b7ceb815d020ffaf7ee6177cdb714622748