Micromachined jets for liquid impingement cooling of VLSI chips

By Evelyn N. Wang, Lianpei Zhang, Linan Jiang, J. Koo, J. Maveety, Eduardo A. Sanchez, Kenneth E. Goodson, Thomas W. Kenny. Journal of microelectromechanical systems, 2004

169 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/d40844c4a0f6b780398dd551c2e085ce7dff9e69

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Mechanical Engineering

1. Akhilesh V. Bapat
2. Satish G. Kandlikar
3. A. Gomez
4. Weiwei Deng
5. Gangtao Liang
6. I. Mudawar
7. Suresh V. Garimella
8. Yoav Peles

Citations in the corpus

• Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal (2007, methodology): “[13] used two-phase, multiple microjet arrays of diameters 40–76 μm to cool VLSI chips.”
• Electrospray cooling for microelectronics (2011, background): “Contents lists available at ScienceDirect International Journal of Heat and Mass Transfer journal homepage: www.elsevier .com/locate / i jhmt Electrospray cooling for microelectronics Weiwei Deng a, Alessandro Gomez b,⇑ a Department of Mechanical, Material and Aerospace Engineering, University of Ce”