Effect of specimen size on Young's modulus and fracture strength of polysilicon

By William N. Sharpe, K. Jackson, K. Hemker, Z. Xie. 2001

200 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/d07ef4c4cb7836b139c07299c6519c695bb83b2d

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Electrical and Electronic Engineering

1. K. Hemker
2. Richard E. Thompson
3. J. Pulskamp
4. Ronald Polcawich
5. William N. Sharpe
6. Chris Eberl
7. D. Gianola

Citations in the corpus

• Strain Measurements of Silicon Dioxide Microspecimens by Digital Imaging Processing (2006, background): “It is interesting to note that Fig. 13 looks very similar to Fig. 8 in a 2001 paper [ 24 ] on the effect of specimen size on the strength of”
• Microscale Characterization of Mechanical Properties (2007, background): “For example, measurements that suggested that Young’s modulus decreases for micron-sized specimens were found to be influenced by the fact that undercutting during etching led to errors in sample geometry ( 71 ).”
• Design and Operation of a MEMS-Based Material Testing System for Nanomechanical Characterization (2007, unknown): “Polysilicon was selected as a test material because of its well-characterized Young’s modulus and failure strength [25]–[28].”