Material Removal Mechanisms in Lapping and Polishing

By C. Evans, E. Paul, David A. Dornfeld, D. Lucca, Gerry Byrne, M. Tricard, Fritz Klocke, O. Dambon, B. Mullany. 2003

377 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/9478e55575f4f4e4eba2c59246b0aaf33f831489