The reliability of microelectromechanical systems (MEMS) in shock environments

By V. T. Srikar, Stephen D. Senturia. 2002

229 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/c11cbd7c55db68c203de88b5b601c97d4d28706f

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In Atomic and Molecular Physics, and Optics

1. V. T. Srikar

In Biomedical Engineering

1. S. Spearing
2. V. T. Srikar

In Electrical and Electronic Engineering

1. V. T. Srikar

Citations in the corpus

• Micro-Raman measurement of bending stresses in micromachined silicon flexures (2003, background): “ICROELECTROMECHANICAL systems (MEMS) can be subjected to mechanical loads during fabrication [1], deployment [ 2 ] and operation [3] and are susceptible to failure due to fracture [3], buckling [4], and stiction [5].”
• Vibration and shock reliability of MEMS: modeling and experimental validation (2011, unknown): “The values of the pulse duration and the time period of the system at resonance play an important role in the shock reliability [13].”