Micro-Raman measurement of bending stresses in micromachined silicon flexures

By V. T. Srikar, A. Swan, M. Unlu, B. Goldberg, S. Spearing. 2003

142 citations recorded by the source corpus.

Subfields: Atomic and Molecular Physics, and Optics, Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/9ea31dcbfe4093a3aa29acbbac8e1a894dac361a

How researchers see this paper

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In Atomic and Molecular Physics, and Optics

1. S. Vengallatore
2. S. Prabhakar

In Electrical and Electronic Engineering

1. S. Vengallatore
2. S. Prabhakar

Citations in the corpus

• Theory of Thermoelastic Damping in Micromechanical Resonators With Two-Dimensional Heat Conduction (2008, background): “For an Euler‐Bernoulli beam undergoing bending deformation (and ignoring the regions in the vicinity of the clamped ends [ 40 ]), we can consider σxx to be the only nonzero component of the stress tensor.”