Wafer Map Defect Pattern Classification and Image Retrieval Using Convolutional Neural Network

By T. Nakazawa, Deepak V. Kulkarni. IEEE transactions on semiconductor manufacturing, 2018

339 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Media Technology

View Paper: https://www.semanticscholar.org/paper/ac55785069db5ebf4b8f5bd50a50a2c74aa3c3e8

How researchers see this paper

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1. Jinlong Zhu
2. Jiamin Liu
3. Shiyuan Liu
4. Zexu Zhang
5. Tianlai Xu
6. Shuai Yuan
7. R. Zhou
8. Hao Jiang

Citations in the corpus

• Optical wafer defect inspection at the 10 nm technology node and beyond (2022, background): “Any random defect in one of the dies will not zero out in the subtraction process, showing up in the subtracted image [66].”