Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

By W. Choi, E. Yeh, King-Ning Tu. 2003

229 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials

View Paper: https://www.semanticscholar.org/paper/ac3e2a12bbb3a48b6727162145558e4225024595

Citations in the corpus

• Failure mechanisms of solder interconnects under current stressing in advanced electronic packages (2010, unknown): “A modified Black’s equation was proposed by inserting a multiplying factor (c) of the current density and a temperature increment (DT) into Black’s equation [34,46]:”