State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography

By Kongjing Li, Guiyun Tian, Liang Cheng, Aijun Yin, Wenping Cao, S. Crichton. IEEE transactions on power electronics, 2014

158 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/dae20f61140243c2658344ae5211a3057e9d69fd

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In Electrical and Electronic Engineering

1. Serkan Dusmez

Citations in the corpus

• In Situ Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives (2015, unknown): “phy [38] and active thermography [39], [40].”
• Remaining Useful Lifetime Estimation for Thermally Stressed Power MOSFETs Based on on-State Resistance Variation (2016, background): “T HE reliability of a power conversion system is mainly dictated by the failure rate of the electrolytic bus capacitor [1]–[3], and the power semiconductor switches [4]–[10].”