Reactive Sputter Deposition

By D. Depla, S. Mahieu. 2008

293 citations recorded by the source corpus.

Subfields: Mechanics of Materials

View Paper: https://www.semanticscholar.org/paper/9f41d620195e582c95e0e5902a191c648affbcdd

How researchers see this paper

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In Mechanics of Materials

1. A. González‐Elipe
2. Á. Barranco
3. A. Borrás
4. A. Palmero
5. A. Anders
6. J. Gudmundsson

Citations in the corpus

• Perspectives on oblique angle deposition of thin films: From fundamentals to devices (2016, methodology): “Based on standard binary collision approaches [309], the sputtered particle distribution at the target can be calculated to be proportional to EðEþ UÞ 3 cos n, where E is the kinetic energy, U the solid target binding energy and n the ejection angle.”
• A review comparing cathodic arcs and high power impulse magnetron sputtering (HiPIMS) (2014, background): “[45, 144, 145], and therefore here we can focus on HiPIMS and the fact that ionization is not uniformly distributed.”