Fabrication of ultralow-loss Si/SiO(2) waveguides by roughness reduction.
By Kevin K. Lee, D. Lim, Lionel C. Kimerling, Jang-Ki Shin, F. Cerrina. Optics Letters, 2001
599 citations recorded by the source corpus.
Subfields: Biomedical Engineering, Electrical and Electronic Engineering
View Paper: https://www.semanticscholar.org/paper/9dd56eb3ad91be3bef0476f811d189296c29da29
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In Biomedical Engineering
- Michal Lipson
- B. Luyssaert
- D. van Thourhout
- S. Beckx
- Vincent Wiaux
- Peter Bienstman
- R. Baets
- Wim Bogaerts
In Electrical and Electronic Engineering
- Wim Bogaerts
- R. Baets
- Michal Lipson
- D. van Thourhout
- Pieter Dumon
- D. Taillaert
- Shankar Kumar Selvaraja
- Carlos Angulo Barrios
Citations in the corpus
- Review of Silicon Photonics Technology and Platform Development (2021, methodology): “220 nm de-facto standard was adopted by the research community [9], [10] achieving low losses [11] and tight bending radii”
- A compact silicon-on-insulator polarization splitter (2005, background): “good agreement with the literature [10] and are due to sidewall roughness and can be further reduced by controlled oxidation of the waveguide surfaces [10].”
- Electrooptic modulation of silicon-on-insulator submicrometer-size waveguide devices (2003, background): “Thermal oxidation is also desirable for reducing surface roughness [ 3 ].”
- Size influence on the propagation loss induced by sidewall roughness in ultrasmall SOI waveguides (2004, methodology): “The roughness parameters have been chosen according to recent measurements obtained on similar structures [ 3 ].”