Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization

By Jin-wook Jang, D. Frear, T. Lee, King-Ning Tu. 2000

185 citations recorded by the source corpus.

Subfields: Electrical and Electronic Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/9c28de5e83e87c055bb256e57e0c71b25f7dabcd

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

1. M. He
2. G. Qi
3. Zhong Chen

Citations in the corpus

• Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization (2004, background): “been published on the interaction between Ni-P and Sn-based solders [7-17].”