Principles of Soldering

By G. Humpston, D. Jacobson. 2004

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Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate (2013, background): “This wide variation of wetting angle is probably related to factors such as alloy composition, processing atmosphere, flux type, soldering temperature, substrate metallurgy etc [23,28,29].”
Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules (2007, background): “allows final working temperatures much higher than 280 °C [15][17][22][29][30].”